The invention relates to a liquid ejection head, a liquid ejection apparatus, and a method of manufacturing liquid ejection head. When a wiring substrate is mounted on a flow path substrate having a nozzle plate, a defect that the nozzle plate is damaged is suppressed. The liquid ejection head having a nozzle for ejecting a liquid includes a flow path substrate including a flow path of the liquidin the flow path substrate, a nozzle plate which is attached to the flow path substrate and in which the nozzle is formed, a pressure chamber substrate that is attached to a location facing the nozzleplate with the flow path substrate interposed therebetween and that has a pressure chamber, and a pressure generation portion that operates according to an electrical signal from a wiring substrate coupled to an electrode provided on the pressure chamber substrate and that changes a pressure of the pressure chamber to eject the liquid from the nozzle, in which the nozzle plate and the wiring substrate are disposed such that the nozzle plate does not overlap a coupling portion between the wiring substrate and the electrode when viewed in a thickness direction of the flow path substrate.