A liquid cooling module (70) for cooling an electronic component (66) includes a housing (80) supporting the electronic component (66), where the housing (80) includes a cavity (85) containing a cooling liquid (86). A liquid flow channel (100) can be in fluid communication with the cavity (85) and define a cooling loop (105). A cold plate (90) supporting the housing (80) can have a cooling channel(92) thermally coupled to the liquid flow channel (100).