The invention provides a fabrication method of a transparent conductive film structure. The fabrication method comprises the following steps of providing a flexible substrate; forming a flexible material layer on an upper surface of the flexible substrate; forming a plurality of groove structures on an upper surface of the flexible material layer; forming seed layers in the groove structures; andforming a metal line in each groove structure according to the seed layer, wherein the metal lines are connected to form the transparent conductive film structure. By the seed layer, relatively high reduction performance of iron powder can be enabled to be maintained, so that metal line breakage formed by the seed layers is prevented, and the performance of the formed transparent conductive film structure is further ensured.