The invention relates to a fingerprint module. The fingerprint module comprises a circuit substrate; a fingerprint chip which is arranged on one side of the circuit substrate; a conductive part whichis positioned between the fingerprint chip and the circuit substrate and is used for electrically connecting the fingerprint chip and the circuit substrate; a packaging body which is packaged and formed on the fingerprint chip and the conductive piece; and an explosion-proof layer which covers the surface of one side, far away from the circuit substrate, of the packaging body. The fingerprint chippackaging structure can be prevented from being directly contacted with the external environment and being damaged under the action of an external force. The fingerprint chip can be electrically connected to the external structure through the conductive part, so that there is no need to arrange electric connection structures such as conductive connection lines, the fingerprint module is thinner in thickness, the explosion-proof film can further protect the packaging body, fragments of the packaging body are bonded under the condition that the packaging body is broken, the packaging body is prevented from splashing around after being broken, people are effectively prevented from being injured by the fragments, and accordingly the higher explosion-proof strength is achieved under the condition that the fingerprint chip packaging structure is light and thin.