This application discloses a module structure and a fabrication method therefor. The optical module structure includes: a substrate; an optical chip and an electrical chip that are fixedly connected to the substrate; and an optical coupling structure fixedly connected to the optical chip. A side that is of the optical chip and that faces the substrate has a first reference plane, and at least one first alignment mark is provided on the first reference plane; and the optical coupling structure has a second reference plane, and at least one second alignment mark is provided on the second reference plane. The first reference plane is aligned with the second reference plane, and the first alignment mark is aligned with the second alignment mark. A hybrid encapsulation manner is used for the optical module structure, so that encapsulation density of the optical module structure is increased, and channels of the optical module structure are increased when an area is the same, to support an optical interconnection for a large amount of data. In addition, a passive alignment manner that is convenient and quick is used for the optical module structure, so that an error caused by manual alignment is avoided, and alignment precision is relatively high.