The invention relates to an LED chip soldering device. The LED chip soldering device comprises a soldering chuck, wherein the soldering chuck is composed of an upper chuck body and a lower chuck body;a clamping cylinder is connected between the upper chuck body and the lower chuck body; an electric heating plate is arranged on the inner side surface of the upper chuck body; an electric heating wire is embedded in the electric heating plate; a welding table is arranged on the inner side surface of the lower chuck body; a tin outlet hole is formed in the middle of the welding table; a tin storage cavity communicating with the tin outlet hole is formed in the lower chuck body; an electric heating wire is laid at the bottom of the tin storage cavity; an arc-shaped metal cover plate is arranged in the tin storage cavity; the arc-shaped metal cover plate is buckled in the tin storage cavity to divide the tin storage cavity into an upper tin storage cavity body and a lower tin storage cavitybody; an opening for enabling the upper tin storage cavity body and the lower tin storage cavity body to communicate is formed in the arc-shaped metal cover plate; and a mounting hole is formed in the welding table, ejecting columns are arranged in the mounting hole, a spring is fixed in the mounting hole, and the ejecting columns extend into the upper tin storage cavity body after penetrating through the spring and corresponds to the surface of the arc-shaped metal cover plate. The LED chip soldering device has the advantages that a limited amount of tin in a molten state can be supplied atany time, and waste is avoided.