The invention belongs to the field of material surface treatment, and specifically discloses an anti-oxidation electrochemical treatment method for a copper material. The method comprises using a copper material as a working electrode, and sequentially performing electrochemical reconstruction and electrochemical deposition in an electrolyte containing a stabilizer. The stabilizer is a compound capable of providing formate, such that formate is adsorbed on a surface of the copper material. The electrochemical method is used to enable plating of formate on the surface of the copper material, thereby enhancing the anti-oxidation ability of the copper material. The method is simple to operate; and has good conditions, low costs, and great industrial application prospects.