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发明公开
CN109055800A 一种键合金线及其制备方法 无效 - 撤回

一种键合金线及其制备方法
摘要：
本发明公开了一种键合金线，由质量百分含量的以下各组分组成：铍0.0001％‑0.010％、铁0.0001％‑0.0010％、硅0.0001％‑0.001％，不可避免的其它杂质元素总量0.0001％‑0.01％，余量为金；制备方法为：(1)熔炼；(2)粗中拉；(3)细拉；(4)退火；(5)复绕；(6)包装。本发明制备工艺能够满足键合材料各方面力学性能并能提供更好键合性能，且操作简便，使加工材料获得优良力学性能的键合金线的制备工艺，满足实际使用要求。
摘要（英）：

The invention discloses a gold bonding wire. The gold bonding wire is composed of, by mass, 0.0001%-0.010% of beryllium, 0.0001%-0.0010% of iron, 0.0001%-0.001% of silicon, 0.0001%-0.01% of inevitableother impurity elements in total, and the balance gold. A preparation method comprises the steps of (1) smelting, (2) coarse-medium drawing, (3) fine drawing, (4) annealing, (5) rewinding and (6) packaging. The preparation process of the gold bonding wire can meet various mechanical properties of bonding materials and can also provide better bonding performance, operation is easy and convenient,processing materials can obtain good mechanical properties, and the actual usage requirements are met.

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