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发明授权
CN108933121B 半导体封装装置 有权

半导体封装装置
摘要：
本发明提供一种天线半导体封装装置。所述天线半导体封装装置包含第一导电层、第二导电层、第一导电元件及第一引向元件。所述第二导电层在所述第一导电层上方且与所述第一导电层分隔开。所述第一导电元件将所述第一导电层连接到所述第二导电层。所述第一引向元件邻近于所述第一导电层且通过第一间隙与所述第一导电层分隔开。所述第一导电元件、所述第一导电层及所述第二导电层界定波导空腔和辐射开口。
摘要（英）：

An antenna semiconductor package device includes a first conductive layer, a second conductive layer, a first conductive element and a first directing element. The second conductive layer is over the first conductive layer and separated from the first conductive layer. The first conductive element connects the first conductive layer to the second conductive layer. The first directing element is adjacent to the first conductive layer and separated from the first conductive layer by a first gap. The first conductive element, the first conductive layer and the second conductive layer define a waveguide cavity and a radiation opening.

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