The present invention provides a lamination method and manufacturing method of a printed circuit board. The lamination method of the printed circuit board includes the following steps that: two steelplates of which the surfaces are provided with water-soluble organic films are respectively arranged at the top surface and bottom surface of a circuit board in such a manner that the water-soluble organic material films face the circuit board; and the steel plates and the circuit board are laminated. According to the lamination method provided by the invention, the water-soluble organic films arearranged on the surfaces of the steel plates, and the water-soluble organic films can be easily removed after the lamination is completed, and therefore, the surface wear of the steel plates caused by brushing or grinding performed on the steel plates in a conventional process can be avoided, the automation of the lamination process can be realized, the cyclic utilization of the steel plates is realized, and pollution caused by the flow of PP glue to the surfaces of the steel plates during the lamination process can be avoided. The present invention also provides a manufacturing method of a printed circuit board. The manufacturing method can improve manufacturing efficiency.