Disclosed herein is a method for manufacturing a package structure. According to an exemplary embodiment of the present invention, the method for manufacturing a package structure includes: preparing a die having a metal pillar disposed on one surface thereof; bonding the die on the metal plate to allow the metal pillar to face the outside; forming an insulating film covering the metal plate and the die; buffing the insulating film so as to expose the metal pillar; and manufacturing a first package structure by forming a circuit structure electrically connected to the metal pillar on the insulating film.