The invention provides a substrate interconnection structure for packaging semiconductor device, which is used for a "general" substrate of a semiconductor device, and is formed of non-conductive substrate materials. An even conductive column array is formed in the substrate material. The column extends from the upper surface of the substrate to the lower surface of the substrate. An installing disc of a pipe core can be formed at the upper surface of the substrate material. The column under the installing disc of the pipe core is connected to a column at the periphery of the installing disc of the pipe core. The power supply and the ground loop can be formed through columns which are connected to and surround the installing disc of the pipe core.