A PCD cutter formed by a reactive/exothermic bond formed between the diamond table and the substrate. The bond is formed by applying a small pulse of localized energy to a bonding agent containing exothermic reactive materials which is disposed at the interface of the diamond table and the substrate. The bonding agent may be formed by depositing a plurality of alternating layers of exothermic foils at the interface between the polycrystalline diamond table and the substrate. Additional layers may also be deposited between the polycrystalline diamond table and the plurality of layers of exothermic foils and between the foils and the substrate. One or more refractory layers may also be disposed between the layers of exothermic material and a masking or non-wetting material may be applied toone or more sides of the substrate and diamond table.