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发明公开
CN107887357A 电子器件、电子器件装置、电子设备以及移动体 有权

电子器件、电子器件装置、电子设备以及移动体
摘要：
本发明提供一种能够对与对象进行接合的接合强度的下降进行抑制的电子器件、电子器件装置、电子设备以及移动体。电子器件具有：基体；功能元件，其被配置在所述基体上；配线，其被配置在所述基体上，并与所述功能元件电连接；端子，其被配置在所述基体上，并与所述配线电连接，所述端子具有与所述配线不重叠的非重叠区域。此外，所述端子具有与所述配线重叠的重叠区域。
摘要（英）：

The invention is to provide an electronic device, an electronic device apparatus, an electronic apparatus, and a moving object, each capable of reducing a decrease in bonding strength to a bonding target. An electronic device includes a base body, a functional element disposed on the base body, a wiring disposed on the base body and electrically connected to the functional element, and a terminaldisposed on the base body and electrically connected to the wiring, wherein the terminal includes a non-overlapping region which does not overlap with the wiring. Further, the terminal includes an overlapping region which overlaps with the wiring.

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