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发明公开
CN107858718A 一种用于塑料表面电镀的钯镀液及其应用 无效 - 驳回

一种用于塑料表面电镀的钯镀液及其应用
摘要：
本发明公开了一种用于塑料表面电镀的钯镀液，包括如下组分：二氯四氨合钯0.4～0.5mol/L、氨水0.1～0.5mol/L、异丙醇0.001～0.003mol/L、β-萘磺酸0.001～0.002mol/L、烟酸0.001～0.002mol/L、烟酰胺0.001～0.005mol/L萘三磺酸0.002～0.006mol/L、三偏磷酸钠0.002～0.004mol/L，pH8.0～9.0，溶剂为水。本发明提供的用于塑料表面电镀的钯镀液及其应用，易于扩大生产，且利用该渡液能在塑料表面形成物理性能优良的高纯度光亮钯镀层。
摘要（英）：

The invention discloses a palladium plating solution for plastic surface electroplating. The palladium plating solution comprises the following components: 0.4-0.5mol/L of tetra-ammine dichloro-palladium, 0.1-0.5mol/L of ammonia liquor, 0.001-0.003mol/L of isopropoxide, 0.001-0.002mol/L of beta-naphthalene sulfonic acid, 0.001-0.002mol/L of niacin, 0.001-0.005 mol/L of nicotinamide, 0.002-0.006 mol/L of naphthol trisulfonic acid and 0.002-0.004mol/L of sodium trimetaphosphate. The pH is 8.0-9.0, and the solvent is water. The palladium plating solution for plastic surface electroplating and anapplication thereof, provided by the invention, have the advantages that production is easily enlarged, and a high-purity bright palladium coating with excellent physical properties can be formed on aplastic surface by utilizing the plating solution.

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