The invention discloses a high-heat conduction and high-insulation graphene heat conduction adhesive sheet applied to electronic components, and a production method thereof. The high-heat conduction and high-insulation graphene heat conduction adhesive sheet applied to electronic components comprises epoxy resin, toughened resin, a curing agent, heat conduction powder, graphene, a solvent and an assistant in proportion. The production method of the high-heat conduction and high-insulation graphene heat conduction adhesive sheet comprises the following steps: S1, adding the epoxy resin, toughened resin, the curing agent, the heat conduction powder, graphene, the solvent and the assistant into a stirrer; S2, stirring the added raw materials by the stirrer, adjusting the viscosity by the solvent, and then stopping the stirring to obtain a slurry; S3, performing coating by using the slurry; S4, performing drying by using a high temperature; and S5, transferring and pasting the dried product to a copper plate. The high-heat conduction and high-insulation graphene heat conduction adhesive sheet has the advantages of simple process, high making efficiency, stable quality, good heat conduction effect and low cost.