The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors including at least one of a physically cross-linked silicone elastomer and a covalentlycross-linked silicone elastomer forming reagent mixture, and a MQ resin. Within a temperature range of between about -30 C to about 90 C, the assembly layer has a shear storage modulus at a frequencyof 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6x10-6 1/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5kPa to about 500 kPa within about 1 minute after removing the applied shear stress.