The present invention relates to a thermal packaging device. The thermal insulation device includes a first plate, a second plate formed adjacent to the first plate nest, having a gap between the first plate and the second plate, a porous material disposed between the plates, and a sealing layer, which is arranged between the first plate and the second plate such that the porous material is sealedfrom the environment under less than ambient pressure. Multiple sets of such plates can be used to form a package for a device that thermally insulates the device from the environment.