The embodiments of the present invention provide a circuit board molding method. The method includes the following steps that: a circuit board to be molded is obtained, wherein the circuit board to be molded includes a plurality of circuit board units separated from one another, and all regions in the circuit board to be molded, except the plurality of circuit board units separated from one another, are regions to be cut; a connecting bridge for connecting any two adjacent circuit board units is disposed in the region to be cut between the two adjacent circuit board units in the circuit board to be molded according to a molding and positioning system; first molding is performed on the circuit board to be molded, and the regions to be cut except the connecting bridges, on the circuit board to be molded, are removed; and second molding is performed on the circuit board to be molded which has been subjected to the first molding, and the connecting bridges are removed, so that the circuit board units are obtained. With the circuit board molding method of the invention adopted, the obtained circuit board units do not contain fractured edges. The circuit board molding method can be applied to realizing seamless splicing between circuit board units of certain characteristic circuit boards.