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发明公开
CN107431058A 芯片装置和用于构成接触连接部的方法 无效 - 驳回

芯片装置和用于构成接触连接部的方法
摘要：
本发明涉及一种芯片装置(10)以及一种用于在芯片(18)和导体材料带(14)之间构成接触连接部(11)的方法，所述芯片尤其是功率晶体管等，其中导体材料带在不导电的衬底(12)上构成，其中芯片设置在衬底或导体材料带(15)上，其中分别在芯片的芯片接触面(25)和导体材料带(28)上施加银膏(29)或者铜膏，其中接触导体(30)浸入到芯片接触面上的银膏或铜膏中并且浸入到导体材料带上的银膏或铜膏中，其中包含在银膏或铜膏中的溶剂通过加热至少部分地蒸发，其中接触连接部通过如下方式构成：银膏或铜膏借助于激光能量烧结。
摘要（英）：

The invention relates to a chip arrangement (10) and a method for forming a contact connection (11) between a chip (18), in particular a power transistor or the like, and a conductor material strip (14), said conductor material strip being formed on a non-conductive substrate (12) and the chip being arranged on the substrate or on a conductor material strip (15). A silver paste (29) or copper paste is applied to a chip contact surface (25) of the chip and of the conductor material strip (28), a contact conductor (30) is dipped into the silver paste or the copper paste on the chip contact surface and into the silver paste or the copper paste on the conductor material strip, and a solvent contained in the silver paste or the copper paste is at least partially evaporated by heating. The silver paste or the copper paste is then sintered by means of laser energy, thereby forming the contact connection.

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