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发明公开
CN107046006A 柔性基板结构及其形成方法，柔性电子器件 无效 - 撤回

柔性基板结构及其形成方法，柔性电子器件
摘要：
本发明提供了一种柔性基板结构及其形成方法，和一种柔性电子器件，其中，所述柔性基板结构包括：柔性衬底；位于所述柔性衬底上的平坦化层，所述平坦化层远离所述柔性衬底一侧的表面平坦；位于所述平坦化层上的阻挡层，所述阻挡层用于阻挡氧气和水气的渗透。本发明的柔性基板结构可以有效阻挡氧气和水气的渗透，提高形成于其上的电子器件的可靠性和寿命。
摘要（英）：

The invention provides a flexible substrate structure and a formation method therefor, and a flexible electronic device. The flexible substrate structure comprises a flexible substrate, a planarization layer and a barrier layer, wherein the planarization layer is positioned on the flexible substrate; the surface on one side, far from the flexible substrate, of the planarization layer is flat; the barrier layer is positioned on the planarization layer; and the barrier layer is used for blocking oxygen and moisture permeation. By virtue of the flexible substrate structure provided by the invention, oxygen and moisture permeation can be effectively blocked, so that reliability and service life of the electronic device formed thereon can be improved and prolonged.

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