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发明公开
CN107045937A 电子部件及其制造方法以及电路基板 有权

电子部件及其制造方法以及电路基板
摘要：
本发明提供一种电子部件及其制造方法以及电路基板，该电子部件能够确保基于焊料的充分的接合强度并且缩小安装空间。电子部件包括芯片、覆盖部和露出部。芯片具有：朝向第一轴向的第一和第二端面；朝向与第一轴正交的第二轴向的第一和第二主面；朝向与第一和第二轴正交的第三轴向的第一和第二侧面；和分别覆盖第一和第二端面且分别延伸到第一和第二主面以及第一和第二侧面的第一和第二外部电极。覆盖部从第一主面侧向第二主面侧覆盖芯片。露出部是设置在芯片的第二主面侧、且第一和第二外部电极没有被覆盖部覆盖而露出的区域，沿着将第一和第二端面与第一和第二侧面连接的棱部向第一主面侧突出。
摘要（英）：

An electronic component includes: a chip having first and second end surfaces oriented in a direction of a first axis, first and second main surfaces oriented in a direction of a second axis orthogonal to the first axis, first and second side surfaces oriented in a direction of a third axis orthogonal to the first and second axes, and first and second external electrodes respectively covering the first and second end surfaces and each extending to the first and second main surfaces and side surfaces; a covering portion covering the chip from the first main surface toward the second main surface; and exposed portions provided to the second main surface, including regions where the first and second external electrodes are exposed without being covered with the covering portion, and being pushed out toward the first main surface along ridges connecting the first and second end surfaces and side surfaces.

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