The present invention provides a package, a package-on-package structure comprising the same, and manufacturing methods of a package and a package-on-package structure. The package comprises: a substrate consisting of a first surface, a second surface back to the first surface, and first bonding pad and a second bonding pad arranged on the first surface and separated from each other; a chip installed on the first surface of the substrate and electrically connected with the first bonding pad; a salient point arranged on the second bonding pad and consisting of a first end being in contact with the second bonding pad and a second end opposite to the first end; and a packaging component used for packaging at least one part of the chip and at least one part of the salient point, and exposing the second end of the salient point.