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发明授权
CN107027244B 一种超厚铜线路板的制作方法 有权

一种超厚铜线路板的制作方法
摘要：
本申请公开了一种超厚铜线路板的制作方法，包括：在超厚铜线路板上进行第一次整板喷涂油墨；对所述超厚铜线路板进行第一次预烘干；在所述超厚铜线路板的铜皮上表面中间进行第一次开窗，对所述铜皮的侧面以及基材表面进行第一次填充油墨；在超厚铜线路板上进行第二次整板喷涂油墨；对所述超厚铜线路板进行第二次预烘干；在所述超厚铜线路板的铜皮上表面中间进行第二次开窗，对所述铜皮的侧面以及基材表面进行第二次填充油墨。本申请提供的超厚铜线路板的制作方法，能够减少加工流程，降低生产成本，也能避免油墨气泡的产生。
摘要（英）：

The invention discloses a manufacturing method of an ultrathick copper circuit board. The manufacturing method comprises the steps of performing first integral-board ink spraying on the ultrathick copper circuit board; performing first pre-drying on the ultrathick copper circuit board; performing first windowing on the central part of the upper surface of a copper foil of the ultrathick copper circuit board, performing first ink filling on the side surface of the copper foil and a substrate surface; performing second ink spraying on the ultrathick copper circuit board; performing second pre-drying on the ultrathick copper circuit board; performing second windowing on the central part of the upper surface of the copper foil of the ultrathick copper circuit board, and performing second ink filling on the side surface of the copper foil and the substrate surface. The manufacturing method of the ultrathick copper circuit board has advantages of reducing number of machining processes, reducing production cost and preventing ink bubbles.

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