The invention discloses a single component adhesive for fixing a silicon rod. The single component adhesive comprises the following components by weight percent: 25%-55% of acrylate oligomer, 35%-50% of acrylate monomer, 0-15% of an internal plasticizer, 0.5%-3% of an accelerant, 0.5%-3% of a boosting accelerator, 1%-5% of an initiator, 0.1%-1% of a polymerization inhibitor and 0.1%-1% of a chelating agent. In such a manner, the single component adhesive for fixing a silicon rod provided by the invention is suitable for the cutting and grinding processing of photoelectricity, solar monocrystalline silicon, polycrystalline silicon, semiconductor, and the like, is a product specially used for cutting the silicon rod in photovoltaic industry and is suitable for manual and automatic bonding process of a combination of an iron plate base, glass (resin plate)/glass (resin plate) and a crystal bar.