A heat dissipation system for use with a three-dimensional power amplifier (6), comprising: two C-shaped heat sinks (1) which may surround an outer circumference of the three-dimensional power amplifier (6) after being bilaterally symmetrically arranged; a plurality of first heat pipes (2) are embedded on an outer surface of a C-shaped heat sink (1), and each first heat pipe (2) is C-shaped and is arranged along the C-shaped profile of the C-shaped heat sink (1). The heat dissipation system is small in size, easy to assemble, meets heat dissipation requirements, and may also be applied in communications systems that may only dissipate heat in a single plane without requiring major changes to the communications system, being easy to operate, and having high application compatibility and flexibility. The heat dissipation system for use with the three-dimensional power amplifier (6) may be widely applied in the field of communications.