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CN106847771B 具有天线的半导体封装及其制作方法 有权

具有天线的半导体封装及其制作方法
摘要：
一种具有天线的半导体封装及其制作方法，半导体封装包括一基板；多个的接脚垫片、一射频垫片、一半导体元件、一第一SMD元件、一封装材、一PCB天线及一第一导电焊料。射频垫片用以接收或传送一射频信号，并且置于基板的顶侧。第一SMD元件安装于射频垫片。封装材设置于基板的顶侧，并覆盖半导体元件及第一SMD元件。PCB天线设置于封装材上。其中导电焊料与第一SMD元件彼此堆叠，且设置于射频垫片与PCB天线的一馈给结构间。通过调整PCB天线与无线功能电路间的隔离度，来轻易地减少或精确地控制该半导体封装的LO泄漏。更具体而言，使用共形天线结构的半导体封装的高度可以进一步减小，并制造出具有天线的半导体封装，以降低成本且有较佳的生产良品率。
摘要（英）：

A semiconductor package includes a substrate, a plurality of pin pads, a radio frequency (RF) pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna and a conductive solder. The RF pad is used to receive or transmit an RF signal on the top side of the substrate. The SMD component is mounted on the RF pad. The mold compound on the top side of the substrate covers the semiconductor component and the SMD component. The PCB antenna is located on the mold compound. Wherein, the conductive solder and the SMD component are stacked between the RF pad and a feeding structure of the PCB antenna.

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