Embodiments of the present invention provide a middle frame member and a method for manufacturing a middle frame member. The middle frame member is a support part inside an electronic product for supporting components in the electronic product, and the middle frame member includes: a middle frame substrate body; a first metal layer, attached to a first area of the middle frame substrate body, where a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, the first area includes all or a part of an outer surface of the middle frame substrate body, and the first metal layer is used to conduct, to the entire first metal and the middle frame substrate body, heat generated by at least one of the components that is in contact with or adjacent to the first metal layer; and a passivated insulation layer, attached to a surface of the first metal layer. According to the embodiments of the present invention, heat dissipation performance of the middle frame member can be improved.