A heat releasing device for a solid-insulated device according to embodiments of the present disclosure, includes: a heat releasing member made of metal, which heat releasing member has prescribed area, a connecting conductor which is fixed to the heat releasing member and connected to a main circuit of the solid-insulated device, an insulating layer formed around the heat releasing member and the connecting conductor, an interface from which an end of the connecting conductor protrudes and exposes, and a grounding layer formed on the outer circumference of the insulating layer.