The invention discloses a wafer discharging method, auxiliary device and device, and CMP equipment comprising the wafer discharging device. The wafer discharging method comprises the following steps of conveying a wafer to the position above a discharge surface; releasing the wafer to enable the wafer to move towards the discharge surface; spraying liquid to the lower surface of the wafer in the moving process of the wafer to provide buffering force for the moving wafer. According to the wafer discharging method provided by the embodiment of the invention, the wafer can be prevented from being scratched and broken during wafer discharging; accordingly, the yield of wafers can be increased, the productivity and efficiency can be improved, the frequency of shutdown maintenance can be reduced, and the cost can be lowered.