This wiring board (11), which is provided in order to improve the manufacturing efficiency of a semiconductor device, is provided with: a transparent supporting body (12); an adhesive layer (13) having a release layer (41), which is arranged on a main surface (12a) of the supporting body (12) and contains a third resin that is decomposable by irradiation of light, and a protective layer (42) which is arranged on the release layer (41) and contains a fourth resin; and a laminate (21) which is arranged on the adhesive layer (13) and comprises a first resin layer (14), a second resin layer (19) that is arranged on the first resin layer (14), and a wiring pattern (18) that is arranged at least between the first resin layer (14) and the second resin layer (19). Consequently, a semiconductor chip (22) and the wiring board (11), which is an external connection member, are able to be manufactured separately, thereby improving the manufacturing efficiency of a semiconductor device (1).