The present invention discloses a printed wiring board circuit figure manufacturing method based on a magnetron sputtering technology. The method employs an isolation layer to shield a non-circuit area on an insulation matrix and expose an area required forming a line, the line is directly formed on the insulation matrix through magnetron sputtering and is thickened through electroplating to obtain a finished product. Because the line can be directly formed with no need for an etching operation, the printed wiring board circuit figure manufacturing method based on the magnetron sputtering technology can effectively improve the efficiency of the production of the circuit board, prevent from the generation of etching waste water and improve the environmentally friendly degree of the circuit board production industry while effectively reducing the consumption of raw metal.