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发明授权
CN106133919B 晶元级光学组件及其制造方法 有权

晶元级光学组件及其制造方法
摘要：
用于制造复数个光学组件的方法，每一光学组件包括第一光学元件(C1)及第二光学元件(C2)，该方法包括以下的步骤:a)提供第一基板晶元(S1)，复数个第一光学元件(C1)存在于第一基板晶元上的顶侧上；b)提供具有材料区域的第二基板晶元(S2)，材料区域为连续横向地界定的区域，第二基板的材料存在于材料区域中，其中，复数个第二光学元件(C2)存在于材料区域中；c)实现第一基板晶元(S1)与第二基板晶元(S2)的横向对齐，使得每一个第一光学元件(C1)存在于不与材料区域重迭的横向地界定的区域中；d)在横向对齐的状态下使第一基板晶元与第二基板晶元互连，使得第一基板晶元的顶侧面对第二基板晶元的底侧，且在第一基板晶元与第二基板晶元之间不具有进一步的晶元。以此方式，第一和第二光学元件可被放置成特别地靠近彼此。
摘要（英）：

The method for manufacturing a plurality of optical modules each comprising a first (C1) and a second (C2) optical component comprises the steps of a) providing a first substrate wafer (S1) on which a plurality of the first optical components (C1) is present on a top side of the first substrate wafer; b) providing a second substrate wafer (S2) having a material region which is a continuous laterally defined region in which material of the second substrate is present, wherein a plurality of the second optical components (C2) is present in said material region; c) achieving a lateral alignment of the first (S1) and second (S2) substrate wafers such that each of the first optical components (C1) is present in a laterally defined region not overlapping said material region; d) interconnecting the first and second substrate wafers in said lateral alignment such that the top side of the first substrate wafer faces a bottom side of the second substrate wafer with no further wafer in between. This way, first and second optical components may be placed particularly close to each other.

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