The invention provides a stacked integrated circuit package structure. The stacked integrated circuit package structure comprises an upper chip, a lower chip and a package resin layer, wherein the upper chip and the lower chip are electrically connected by a plurality of soldering balls, a gap between the upper chip and the lower chip is filled with the package resin layer, the stacked integrated circuit package structure is characterized in that the upper/lower chip is provided with a rough region from outer sides of the plurality of welding balls to an edge of the upper/lower chip, the roughness of the rough region is between 50 micrometers and 300 micrometers, an adhesive layer is arranged in package resin and has a patterned structure, the patterned structure is a series of concentric square frames from an overhead view, and the concentric frames encircle the plurality of welding balls and are expanded to the edges of the chips.