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发明公开
CN106102985A 透明材料和不透明材料的激光焊接 有权

透明材料和不透明材料的激光焊接
摘要：
本发明公开了电子设备中的透明材料的焊接。电子设备(100)可包括具有穿过壳体(102)的一部分形成的至少一个孔的壳体(102)。该电子设备(100)还可包括被定位在穿过壳体的一部分形成的孔内的部件(104)。该部件(104)可被激光焊接至穿过壳体形成的孔。此外，该部件(104)可包含透明材料。用于将部件固定在电子设备(100)内的方法可包括提供包括至少一个孔的电子设备壳体，并且将部件(104)定位在穿过壳体形成的孔内。被定位在孔内的部件(104)可包含透明材料。该方法还可包括将部件(104)焊接到电子设备壳体。
摘要（英）：

The invention discloses welding of transparent material in electronic devices. An electronic device (100) may include an enclosure (102) having at least one aperture formed through a portion of the enclosure (102). The electronic device (100) may also include a component (104) positioned within the aperture formed through the portion of the enclosure. The component (104) may be laser welded to the aperture formed through the enclosure. Additionally, the component (104) may include transparent material. A method for securing a component within an electronic device (100) may include providing an electronic device enclosure including at least one aperture, and positioning a component (104) within the aperture formed through the enclosure. The component (104) positioned within the aperture may include a transparent material. The method may also include welding the component (104) to the electronic device enclosure.

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