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发明授权
CN106098658B 半导体装置封装及其制造方法 有权

半导体装置封装及其制造方法
摘要：
一种半导体封装包含衬底、一组电组件、螺柱、锥形电互连件和封装体。所述电组件安置于所述衬底的顶表面上。所述螺柱的底表面安置于所述衬底的所述顶表面上。所述电互连件的底表面安置于所述螺柱的顶表面处。所述螺柱的宽度大于或等于所述电互连件的所述底表面的宽度。所述封装体安置于所述衬底的所述顶表面上，且包封所述电组件、所述螺柱和一部分所述电互连件。所述封装体暴露所述电互连件的顶表面。
摘要（英）：

A semiconductor package includes a substrate, a set of electrical components, a stud, a tapering electrical interconnection and a package body. The electrical components are disposed on a top surface of the substrate. A bottom surface of the stud is disposed on the top surface of the substrate. A bottom surface of the electrical interconnection is disposed at a top surface of the stud. A width of the stud is greater than or equal to a width of the bottom surface of the electrical interconnection. The package body is disposed on the top surface of the substrate, and encapsulates the electrical components, the stud and a portion of the electrical interconnection. The package body exposes a top surface of the electrical interconnection.

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