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发明公开
CN106087023A 利用PCB板框式电镀夹具保证电流密度均匀的方法 有权

利用PCB板框式电镀夹具保证电流密度均匀的方法
摘要：
本发明提供利用PCB板的框式电镀夹具保证电流密度均匀的方法，所述的框式电镀夹具由第一金属夹框和第二金属夹框组成，其中第一金属夹框和第二金属夹框通过螺帽和伸缩按钮连接，当启动伸缩按钮时，第二金属夹框与第一金属夹框完全重合，第三金属夹框和第四金属夹框分别与第一金属夹框和第二金属夹框对称，且第三金属夹框和第四金属夹框通过两个活页夹与第一金属夹框和第二金属夹框铰接而成；采用上述框式电镀夹具进行PCB板电镀的同时，采用滤波≦5％的大功率水冷式整流器配合使用。本发明采用特殊设计的框式电镀夹具可以有效保证电流密度的均匀性，同时采用大功率水冷式整流器来保证输入端电流的稳定性，更利于电镀的均匀性。
摘要（英）：

The invention provides a method for guaranteeing current density uniformity by using a PCB frame type electroplating fixture. The frame type electroplating fixture consists of a first metal clamping frame and a second metal clamping frame, wherein the first metal clamping frame and the second metal clamping frame are connected through a screw cap and an extension button; when the extension button is started, the first metal clamping frame and the second metal clamping frame are totally overlapped, and a third metal clamping frame and a fourth metal clamping frame are respectively symmetric to the first metal clamping frame and the second metal clamping frame, and are hinged with the first metal clamping frame and the second metal clamping frame through two hinge clamps; and when the frame type electroplating fixture is used for PCB electroplating, a high-power water-cooled rectifier with filtering of not more than 5% is matched for use. The method can effectively guarantee the current density uniformity by using the frame type electroplating fixture with special design, adopts the high-power water-cooled rectifier to guarantee the current stability at an input end, and facilitates the electroplating uniformity.

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