An encapsulation mold cleaning device is used for carrying out sweeping and dust collecting on an upper parting surface and a lower parting surface of an encapsulation mold, and comprises a first support and a second support; the first support is in sliding connection with the second support; an advancing and retreating drive mechanism used for driving the second support to advance and retreat is mounted between the first support and the second support, and an upper cleaning device used for carrying out sweeping and dust collecting on the upper parting surface of a mold and a lower cleaning device used for carrying out sweeping and dust collecting on the lower parting surface of the mold are connected to the front portion of the second support in a vertical sliding manner; an upper driving device used for driving the upper cleaning device to move upwards and a lower driving device used for driving the lower cleaning device to move downwards are arranged on the second support; and the advancing and retreating drive mechanism, the upper cleaning device, the upper driving device, the lower cleaning device and the lower driving device are all in electric signal connection with a controller. After the encapsulation mold is opened, the upper parting surface and the lower parting surface of the mold can be automatically subject to sweeping and dust collecting at the same time, and therefore labor intensity of workers is greatly reduced; and production efficiency is improved, and personal injuries are avoided.