The invention belongs to the technical field of circuit board processing and manufacturing, particularly relates to a manufacturing method for a printed circuit board capable of replacing the embedded resistor design, and solves the technical problems of poor stability of an existing embedded resistor printed circuit board. The method comprises the following steps that 1. plate material of the internal layer is manufactured; 2. a conductor line is manufactured; 3. a connecting layer is manufactured; 4. a resistive layer is manufactured; 5. resistor patterns are manufactured; and 6. the resistive layer is checked. The advantages are that the connecting layer is adopted so that combining force of unit area can be increased, combining area of heterogeneous materials can also be increased, combining force between the heterogeneous materials can be substantially enhanced, and thus product application reliability is enabled to be higher and manufacturing stability is better; meanwhile, the resistive layer is exposed out of conductor layers so that the resistance value can be accurately tested and controlled and the product electrical performance is enabled to be more stable.