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发明公开
CN105802127A 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板 有权

一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板
摘要：
本发明涉及一种无卤热固性树脂组合物及使用它的预浸料及印制电路用层压板。所述无卤热固性树脂组合物，有机固化物按100重量份计，包含(A)无卤环氧树脂30～60重量份；(B)第一固化剂：含磷双酚5～30重量份；(C)第二固化剂：双环戊二烯型酚醛5～30重量份；(D)含磷阻燃剂。本发明所提供的无卤热固性树脂组合物制成的预浸料及印制电路用层压板，具有高玻璃化转变温度、优异的介电性能、低吸水率、高耐热性和良好的工艺加工性，并能实现无卤阻燃，达到UL94V-0。
摘要（英）：

The invention relates to a halogen-free thermosetting resin composition, a prepreg prepared from the halogen-free thermosetting resin composition and a laminated plate for a printed circuit. The halogen-free thermosetting resin composition comprises, by weight, 30-60 parts of halogen-free epoxy resin, 5-30 parts of phosphorus-containing bisphenol as a first curing agent, 5-30 parts of dicyclopentadiene-type phenolic aldehyde as a second curing agent and a phosphorus-containing fire retardant. The prepreg prepared from the halogen-free thermosetting resin composition and the laminated plate for a printed circuit have high glass-transition temperatures, excellent dielectric properties, low water absorption rates, high heat resistance and good processability, realizes halogen-free flame retardation and has a UL94V-0 level.

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