The invention provides a packaging stack structure, which comprises a first substrate, a first electronic assembly and a second substrate, wherein the first electronic assembly is arranged on the first substrate and is electrically connected with the first substrate; the second substrate is arranged on the first substrate and covers the first electronic assembly; an opening is formed in the second substrate; the position of the first electronic assembly corresponds to the position of the opening, so that the first electronic assembly does not displace due to collision of the second substrate; the yield loss is reduced; the design of the opening also has a function of facilitating alignment; the packaging process can be relatively convenient and simple; and furthermore, the overall structure strength of the packaging stack structure can also be reduced to meet the thinning requirements.