A method of manufacturing an electromagnetic wave shield housing that accommodates an electronic component and shields the electronic component from electromagnetic waves is provided, which includes: placing a resin plate inside a shielding metal plate, the shielding metal plate including a plate central area of the metal plate having a shielding property against the electromagnetic waves, and plate outer peripheral edges that are formed around the plate central area and stand up from the plate central area in standing postures, the resin plate including a central portion that overlaps with the plate central area, and stand-up portions that stand up from the central portion so as to conform to the standing postures and overlap with the plate outer peripheral edges, respectively; and injecting resin to the shielding metal plate, where the resin plate is placed, from outside the shielding metal plate to cover the shielding metal plate with the injected resin from outside. Thus, the electromagnetic wave shield housing can easily be manufactured, without causing any changes to the postures of the plate outer peripheral edges of the shielding metal plate and impeding the weight reduction.