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发明授权
CN105552061B 半导体封装元件 有权

半导体封装元件
摘要：
一种半导体封装元件包含衬底、至少一个组件、封装本体、第一导电层、第一屏蔽层、第二屏蔽层及第二导电层。所述组件设置于所述衬底的第一表面上。所述封装本体设置于所述衬底的所述第一表面上且覆盖所述组件。所述第一导电层覆盖所述封装本体及所述衬底的至少一部分。所述第一屏蔽层覆盖所述第一导电层，且具有第一厚度并包含高电导率材料。所述第二屏蔽层覆盖所述第一屏蔽层，且具有第二厚度并包含高磁导率材料。所述第一厚度对所述第二厚度的比率在0.2到3的范围内。所述第二导电层覆盖所述第二屏蔽层。
摘要（英）：

A semiconductor device package includes a substrate, at least one component, a package body, a first conductive layer, a first shielding layer, a second shielding layer and a second conductive layer. The component is disposed on a first surface of the substrate. The package body is disposed on the first surface of the substrate and covers the component. The first conductive layer covers the package body and at least a portion of the substrate. The first shielding layer covers the first conductive layer and has a first thickness and includes a high conductivity material. The second shielding layer covers the first shielding layer and has a second thickness and includes a high permeability material. A ratio of the first thickness to the second thickness being in a range of 0.2 to 3. The second conductive layer covers the second shielding layer.

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