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发明公开
CN105505285A 一种用于半导体芯片封装的低模量非导电胶 无效 - 驳回

一种用于半导体芯片封装的低模量非导电胶
摘要：
本发明涉及一种用于半导体芯片封装的低模量非导电胶，由以下重量配比的成分组成：二缩三丙二醇二丙烯酸酯20份、三乙二醇二乙烯基醚15份、柔性聚氨酯甲基丙烯酸酯齐聚物13份、过氧化二酰2份、过氧化酯2份、γ-甲基丙烯酰氧基丙基三异丙氧基硅烷5份、微米级三氧化二铝25份、微米级二氧化硅10份、氮化硼10份。固化后的胶具有较小的模量，具有广阔的应用前景。
摘要（英）：

The invention relates to a low-modulus non-conductive adhesive for semiconductor chip packaging. The low-modulus non-conductive adhesive comprises, by weight, 20 parts of tripropylene glycol diacrylate, 15 parts of triethyleneglycoldivinyl ether, 13 parts of a flexible polyurethane methylacrylate oligomer, 2 parts of dibenzoyl peroxide, 2 parts of peroxyester, 5 parts of gamma-methacryloxypropyltriisopropoxysilane, 25 parts of micron-sized alumina, 10 parts of micron-sized silica and 10 parts of boron nitride. The cured low-modulus non-conductive adhesive has small modulus and a wide application prospect.

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