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Invention Publication
CN105475412A 制造华夫产品的切割台、装置和方法 失效 - 权利终止

制造华夫产品的切割台、装置和方法
Abstract:
本发明涉及一种切割台(1)、装置和方法，用于截断华夫块(2)的侧向的、平行于切割方向延伸的边缘(3)，且根据需要用于分割华夫块(2)，其中所述切割台包括：至少一个被布置在切割区域(6)中的切割体(7)，该切割体(7)超过输送面(5)至少华夫块(2)的厚度(8)；沿着切割方向(9)可移动地布置且由驱动装置(10)驱动的推动装置(11)，其用于移动单个华夫块(2)或单个华夫块堆通过切割区域(6)，所述推动装置以这样的方式被构建，其中，推动装置(11)包括第一推动体(12)和第二推动体(13)，其中，通过至少一个驱动装置(10,19,20)，第一推动体(12)和第二推动体(13)沿着或以切割方向(9)可移动地布置，且其中，通过至少一个驱动装置(10,20)第二推动体(13)相对于第一推动体(12)可移动地布置。
Abstract(English):

The invention relates to a cutting station (1), system and method for separating the lateral edge (3), parallel to the cutting direction, of the wafer blocks (2) and for dividing the wafer blocks (2) as required, the cutting station including at least one cutting body (7) disposed in a cutting area (6) and projecting beyond the conveyor surface (5) at least to the thickness (8) of the wafer block (2); one pusher (11) movably arranged along the cutting direction (9) and driven by a driver (10) for pushing individual wafer blocks (2) or individual wafer block stacks through the cutting area (6), wherein the pusher (11) comprises a first pushing body (12) and a second pushing body (13), wherein the first pushing body (12) and the second pushing body (13) are arranged to be movable via at least one driver (10, 19, 20) along or in the direction of the cutting direction (9), and wherein the second pushing body (13) is movably disposed relative to the first pushing body (12) by at least one driver (10, 20).

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