The invention relates to a partially-embedded type circuit structure, which comprises a first dielectric layer, a first circuit layer embedded in a surface of the first dielectric layer, a second circuit layer embedded in another surface of the first dielectric layer, first solder mask layers covering the first circuit layer, and second solder mask layers covering the second circuit layer, wherein each first solder mask layer comprises at least one first opening for exposing parts of the first circuit layer, and the parts, positioned in the first openings, of the first circuit layer are basically coplanar with the first solder mask layers; and each second mask layer comprises a plurality of second openings for exposing parts of the second circuit layer. The invention further relates to a manufacturing method of the partially-embedded type circuit structure.