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发明授权
CN105449397B 连接器模块 有权

连接器模块
摘要：
连接器模块(102)包括壳体(108)和导电引线框架(110)。壳体包括在其间限定腔体(120)的盖体(122)和基座(124)。腔体将电路卡(106)接收其中。基座具有顶侧(126)和底侧(128)。顶侧朝向盖体并限定部分腔体。多个窗口(130)在顶侧与底侧之间延伸穿过基座。基座包括至少部分由非导电层(164)覆盖的导电层(154)。导电引线框架联接至基座的底侧。引线框架包括多个接触梁(112)，其延伸穿过基座的窗口进入到腔体中。引线框架通过基座的非导电层与基座的导电层电隔离。引线框架还包括安装触头(114)，其被构造为安装至电路板(104)的导电部件(116)。
摘要（英）：

A connector module (102) includes a housing (108) and a conductive lead frame (110). The housing includes a cover (122) and a base (124) that define a cavity (120) therebetween. The cavity (120) receives a circuit card (106) therein. The base (124) has a top side (126) and a bottom side (128). The top side (126) faces the cover (122) and defines part of the cavity (120). Multiple windows (130) extend through the base (124) between the top and bottom sides (126, 128). The base (124) includes a conductive layer (154) at least partially covered by a non-conductive layer (164). The conductive lead frame (110) is coupled to the bottom side (128) of the base (124). The lead frame (110) includes multiple contact beams (112) that extend into the cavity (120) through the windows (130) of the base (124). The lead frame (110) is electrically isolated from the conductive layer (154) of the base (124) by the non-conductive layer (164) of the base (124). The lead frame (110) further includes mounting contacts (114) configured to be mounted to conductive components (116) of a circuit board (104).

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