To provide a conductor paste filling method allowing production costs to be reduced and productivity to be improved, and a production method for a multilayer printed circuit board. A conductor paste filling method according to an embodiment of the invention comprises the step of providing a protection film (6) on a main face (1a) of a metal foil-clad multilayer board (3), the step of forming bottomed via holes (7, 8, 9), the step of removing the protection film (6) up to an intermediate depth from the surface to form a conductor paste flowing groove (11) whereof the bottom exposes the bottomed via holes (7, 8, 9), the step of disposing a housing member (30) over the protection film (6) thereby causing a conductor paste injection flow path (31) and an evacuation flow path (32) to communicate with a conductor paste flowing space (S), the step of reducing the pressure of the conductor paste flowing space (S) via the evacuation flow path (32), and the step of injecting a conductor paste (20) through the conductor paste injection flow path (31) into the conductor paste flowing space (S) thereby filling the conductor paste (20) into the bottomed via holes (7, 8, 9).