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CN105265027A 结构体、无线通信装置以及结构体的制造方法 无效 - 撤回

  • Patent Title: 结构体、无线通信装置以及结构体的制造方法
  • Patent Title (English): Structure, wireless communication device and method for manufucturing structure
  • Application No.: CN201480012407.4
    Application Date: 2014-01-31
  • Publication No.: CN105265027A
    Publication Date: 2016-01-20
  • Inventor: 引野望 , 武部裕幸
  • Applicant: 夏普株式会社
  • Applicant Address: 日本大阪府
  • Assignee: 夏普株式会社
  • Current Assignee: 夏普株式会社
  • Current Assignee Address: 日本大阪府
  • Agency: 北京市隆安律师事务所
  • Agent 权鲜枝
  • Priority: 2013-061034 2013.03.22 JP
  • International Application: PCT/JP2014/052212 2014.01.31
  • International Announcement: WO2014/148121 JA 2014.09.25
  • Date entered country: 2015-09-06
  • Main IPC: H05K1/02
  • IPC: H05K1/02 ;  H01Q1/38
结构体、无线通信装置以及结构体的制造方法
Abstract:
第一树脂层(1)具有被第二树脂层(2)覆盖的覆盖区域和露出区域(1a)，在露出区域(1a)具有触点部(1b)，且在覆盖区域和露出区域(1a)的边界与触点部(1b)之间具有曲折部(1c)。
Abstract(English):

A first resin layer (1) has a covered area covered by a second resin layer (2) and an exposed area (1a); has a contact portion (1b) in the exposed area (1a); and has a bent portion (1c) which is between the contact portion (1b) and the boundary between the covered area and the exposed area (1a).

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