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发明授权
CN105190878B 半导体元件搭载用引线框及其制造方法 有权 转让

半导体元件搭载用引线框及其制造方法
摘要：
提供一种有效地满足半导体元件搭载部和端子部与密封树脂之间的密合性的半导体元件搭载用引线框。在引线框的半导体元件搭载部和端子部中的至少一者的侧面具有突起部(4)，该突起部(4)突出到比该半导体元件搭载部的上表面和下表面的缘或端子部的上表面和下表面的缘靠水平方向的部位，该突起部(4)的顶端部(5)为大致平面或该突起部(4)的顶端部(5)的截面的轮廓呈圆弧状，并且该突起部(4)为厚壁。
摘要（英）：

A lead frame for mounting semiconductor element includes a protrusion that is horizontally projects from edges of the upper and lower surfaces of a semiconductor-mounting part or a terminal part of the lead frame and that is provided on a lateral side of at least one of the semiconductor-mounting part or the terminal part of the lead frame, wherein the top end of the protrusion is substantially flat or the profile of the cross section of the top end is arc-shaped, and the top end of the protrusion is thick.

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